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Tin bar

Tin bar

SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
Tin wire

Tin wire

SIGMA tin wire can provide products with various alloy formulations, wire diameters, and flux cores, suitable for all welding applications (drag welding, aluminum welding, nickel welding, stainless steel) and special process welding, and introduces porous tin wire.
Solder paste

Solder paste

SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
Solder Preforms

Solder Preforms

SIGMA solder preforms are the solution for applications such as printed circuit board assembly, power module board connection, auto parts assembly, electronic assembly assembly, etc.
Nanocoating

Nanocoating

NanoSlic nano coating is a next-generation stencil coating technology developed to meet the growing demand of the electronic assembly industry and the refinement of electronic components. NanoSlic Nanocoatings are polymers that coat the bottom surface and pore walls of stencils. This durable coating is both highly hydrophobic and oleophobic, improving the release properties of the solder paste. NanoSlic heat cures and is a permanent coating. NanoSlic technology improves solder paste transfer efficiency for small apertures, resulting in higher yields and less rework.
Electroplating anode

Electroplating anode

Electroplating anode products provided by SIGMA are all made of high-purity refined tin smelting. Through strict process control, it ensures low tin sludge generation and higher conductivity during the electroplating process. It is suitable for PCB surface treatment, semiconductor IC and other industries. application.
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Contact us

Dongguan Xingma Soldering Co., Ltd.
Building 3, Guanghui Industrial Zone B, Dongcheng Science and Technology Park, Bayi Road, Dongcheng District, Dongguan City
TEL:
0769-27382189
FAX:0769-27384958
Contact:Mr. Du
13686663819
 E-mail:sm@sigmasolder.com
http://www.sigmasolder.com

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Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.