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Solder Preforms
 

SIGMA Solder Preforms are solutions for applications such as printed circuit board assembly, power module board connection, auto parts assembly, electronic assembly assembly, and more. It is suitable for a large number of manufacturing processes with small tolerances. Different types of tin alloy solder tabs can be customized according to customer needs to meet customers' more complex component packaging applications. Various sizes of thickness from 0.02mm-0.50mm are available, and the processing accuracy of the solder tab molds High, can provide a wide variety of shapes, suitable for various industrial fields.

 

 


 

Coated Solder Tab
 

Provide a layer of durable, uniform and transparent flux coating for the solder tab. The amount of flux in the coating is uniform and the volume or weight percentage of the flux can be well controlled. Solder Preforms> Flux is no-clean and has various types. An active-capacity rosin or rosin-free chemistry for your substrate metal.

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 Tin bar
Tin bar
SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
 Tin wire
Tin wire
SIGMA tin wire can provide products with various alloy formulations, wire diameters, and flux cores, suitable for all welding applications (drag welding, aluminum welding, nickel welding, stainless steel) and special process welding, and introduces porous tin wire.
 Solder paste
Solder paste
SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
 Solder Preforms
Solder Preforms
SIGMA solder preforms are the solution for applications such as printed circuit board assembly, power module board connection, auto parts assembly, electronic assembly assembly, etc.
 Nanocoating
Nanocoating
NanoSlic nano coating is a next-generation stencil coating technology developed to meet the growing demand of the electronic assembly industry and the refinement of electronic components. NanoSlic Nanocoatings are polymers that coat the bottom surface and pore walls of stencils. This durable coating is both highly hydrophobic and oleophobic, improving the release properties of the solder paste. NanoSlic heat cures and is a permanent coating. NanoSlic technology improves solder paste transfer efficiency for small apertures, resulting in higher yields and less rework.
 Electroplating anode
Electroplating anode
Electroplating anode products provided by SIGMA are all made of high-purity refined tin smelting. Through strict process control, it ensures low tin sludge generation and higher conductivity during the electroplating process. It is suitable for PCB surface treatment, semiconductor IC and other industries. application.

Contact us

Dongguan Xingma Soldering Co., Ltd.
Building 3, Guanghui Industrial Zone B, Dongcheng Science and Technology Park, Bayi Road, Dongcheng District, Dongguan City
TEL:
0769-27382189
FAX:0769-27384958
Contact:Mr. Du
13686663819
 E-mail:sm@sigmasolder.com
http://www.sigmasolder.com

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Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.