Tin wire (disposable type)
SIGMA tin wire can provide products with various alloy formulations, wire diameters, and flux cores, suitable for all welding applications (drag welding, aluminum welding, nickel welding, stainless steel) and special process welding, and introduce porous tin wire
Our advantage:
* Reduce burnt black
* Low splash, low residue.
*. Good continuous weldability and fast diffusion.
* low odor
Resin type solder wire flux characteristic table
No |
Project |
Specifications |
Test method |
||||||
1 |
Solder composition (example) |
EB993A(Sn-0.7Cu)/EB965A(Sn96.5Ag3Cu0.5)/FCT SN100C |
- |
||||||
2 |
Line Trail |
Ф0.18mm-3.0mm |
Micrometer, caliper |
||||||
5 |
Flux Range * |
ROL1 |
ROL1 |
ROL0 |
ORH1 |
- |
|||
6 |
Copper plate corrosion test |
PASS |
PASS |
PASS |
NA |
JIS-Z-3197-1999-8.4.1 |
|||
9 |
Surface insulation resistance |
1×109Ω |
1×1011Ω |
1×1010Ω |
≥ 1 x 109Ω |
JIS-Z-3197-1999-8.5.3 Comb Type 2 |
|||
10 |
Diffusion experiment* |
≧80% |
≧80% |
≧80% |
≧85% |
JIS-Z-3197-1999-8.3.1.1 |
※ 1. Flux range (halogen content of rosin-based flux): ROLO;0.0%,ROL1;<0.5%
※ 2. Insulation resistance value: Condition 85℃±2℃ Relative humidity 80-90%RH 168hr
※ 3. Electromigration experiment: condition 85℃±2℃ Relative humidity 80-90%RH 1000hr
Note) All data recorded on this website are the results obtained under specific conditions, so its values are not guaranteed, and the final interpretation right belongs to our company.
Tin wire (washable)
A specially developed high-performance lead-free tin wire. Residues can be removed with deionized water without the use of cleaning agents. High activity and good wettability on different substrates.
Cleaning requirements:
Residues should be disposed of after washing within 2 to 3 days. A final rinse with deionized water is recommended, at a temperature of 38-60º (100-140°F) sufficient to remove residues. Other in-line pressure spray cleaning is advisable, but not required.
Low Temperature Tin Wire (Solid Tin-Bismuth Wire)
SIGMA uses its own technology and equipment to process the brittle tin-bismuth eutectic alloy into a solid core wire with a melting point of 139°C, which can meet the packaging of electronic components that are sensitive to soldering temperature. It is also matched with unique additives to achieve superior welding performance.
Porous Wire
A solder wire with 5 truly independent flux-containing holes drawn from one solder wire, evenly distributes the flux throughout the solder wire, exhibits fast wetting Material has excellent solder joints
Why choose porous tin wire:
* Eliminates the risk of missing flux
120 times less likely than competing products
* Improve wetting performance
Flux is closer to the soldering environment
* Quick welding
High purity is shown by reduced variability of molten solder
* Low residue
Increase productivity and reliability
Contact information
Contact us
Dongguan Xingma Soldering Co., Ltd.
Building 3, Guanghui Industrial Zone B, Dongcheng Science and Technology Park, Bayi Road, Dongcheng District, Dongguan City
TEL:0769-27382189
FAX:0769-27384958
Contact:Mr. Du13686663819
E-mail:sm@sigmasolder.com
http://www.sigmasolder.com
COPYRIGHT © 2021 Dongguan Xingma Soldering Co., Ltd. 粤ICP备12010865号 Powered by www.300.cn