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Tin wire (disposable type)
 

SIGMA tin wire can provide products with various alloy formulations, wire diameters, and flux cores, suitable for all welding applications (drag welding, aluminum welding, nickel welding, stainless steel) and special process welding, and introduce porous tin wire



Our advantage:
* Reduce burnt black
* Low splash, low residue.
*. Good continuous weldability and fast diffusion.
* low odor
 
 


Resin type solder wire flux characteristic table

No

Project

Specifications

Test method

1

Solder composition (example)

EB993A(Sn-0.7Cu)/EB965A(Sn96.5Ag3Cu0.5)/FCT SN100C

-

2

Line  Trail

                Ф0.18mm-3.0mm

Micrometer, caliper

5

Flux Range *

ROL1

ROL1

ROL0

ORH1

-

6

Copper plate corrosion test

PASS

PASS

PASS

NA

JIS-Z-3197-1999-8.4.1

9

Surface insulation resistance

1×109Ω

1×1011Ω

1×1010Ω

≥ 1 x 109Ω
After washing

JIS-Z-3197-1999-8.5.3  Comb Type 2

10

Diffusion experiment*

≧80%

≧80%

≧80%

≧85%

JIS-Z-3197-1999-8.3.1.1


※ 1. Flux range (halogen content of rosin-based flux): ROLO;0.0%,ROL1;<0.5%
※ 2. Insulation resistance value: Condition 85℃±2℃ Relative humidity 80-90%RH 168hr
※ 3. Electromigration experiment: condition 85℃±2℃ Relative humidity 80-90%RH 1000hr
Note) All data recorded on this website are the results obtained under specific conditions, so its values ​​are not guaranteed, and the final interpretation right belongs to our company.

 


 

Tin wire (washable)
 

A specially developed high-performance lead-free tin wire. Residues can be removed with deionized water without the use of cleaning agents. High activity and good wettability on different substrates.

 

 

 


Cleaning requirements:
Residues should be disposed of after washing within 2 to 3 days. A final rinse with deionized water is recommended, at a temperature of 38-60º (100-140°F) sufficient to remove residues. Other in-line pressure spray cleaning is advisable, but not required.

 



Low Temperature Tin Wire (Solid Tin-Bismuth Wire)
 

SIGMA uses its own technology and equipment to process the brittle tin-bismuth eutectic alloy into a solid core wire with a melting point of 139°C, which can meet the packaging of electronic components that are sensitive to soldering temperature. It is also matched with unique additives to achieve superior welding performance.

 

 

 


 

Porous Wire 
 

A solder wire with 5 truly independent flux-containing holes drawn from one solder wire, evenly distributes the flux throughout the solder wire, exhibits fast wetting Material has excellent solder joints
Why choose porous tin wire:
* Eliminates the risk of missing flux
120 times less likely than competing products
* Improve wetting performance
Flux is closer to the soldering environment
* Quick welding
High purity is shown by reduced variability of molten solder
* Low residue
Increase productivity and reliability

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Product categories:
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 Tin bar
Tin bar
SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
 Tin wire
Tin wire
SIGMA tin wire can provide products with various alloy formulations, wire diameters, and flux cores, suitable for all welding applications (drag welding, aluminum welding, nickel welding, stainless steel) and special process welding, and introduces porous tin wire.
 Solder paste
Solder paste
SIGMA EB/T&FCT SN100C series tin bars are processed by vacuum continuous casting. This method removes pollutants to varying degrees and reduces the oxygen content of the solder bars. As a result, products with higher purity and less tin slag are obtained, which improves the welding performance. Quality, reduce defects.
 Solder Preforms
Solder Preforms
SIGMA solder preforms are the solution for applications such as printed circuit board assembly, power module board connection, auto parts assembly, electronic assembly assembly, etc.
 Nanocoating
Nanocoating
NanoSlic nano coating is a next-generation stencil coating technology developed to meet the growing demand of the electronic assembly industry and the refinement of electronic components. NanoSlic Nanocoatings are polymers that coat the bottom surface and pore walls of stencils. This durable coating is both highly hydrophobic and oleophobic, improving the release properties of the solder paste. NanoSlic heat cures and is a permanent coating. NanoSlic technology improves solder paste transfer efficiency for small apertures, resulting in higher yields and less rework.
 Electroplating anode
Electroplating anode
Electroplating anode products provided by SIGMA are all made of high-purity refined tin smelting. Through strict process control, it ensures low tin sludge generation and higher conductivity during the electroplating process. It is suitable for PCB surface treatment, semiconductor IC and other industries. application.

Contact us

Dongguan Xingma Soldering Co., Ltd.
Building 3, Guanghui Industrial Zone B, Dongcheng Science and Technology Park, Bayi Road, Dongcheng District, Dongguan City
TEL:
0769-27382189
FAX:0769-27384958
Contact:Mr. Du
13686663819
 E-mail:sm@sigmasolder.com
http://www.sigmasolder.com

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Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.
Dongguan Xingma Soldering Co., Ltd.